Vertiv is increasing the Vertiv™ CoolChip CDU (coolant distribution items) household with the launch of the Vertiv™ CoolChip CDU 70, Vertiv™ CoolChip CDU 100 and Vertiv™ CoolChip CDU 600 fashions in Europe, the Center East and Africa (EMEA). These direct-to-chip (DTC) liquid cooling options improve Vertiv’s place as a number one innovator and enabler in AI and HPC infrastructure. The Vertiv CoolChip CDU 600 will likely be showcased for the primary time in EMEA on the Vertiv sales space at Datacloud International Congress held this week in Cannes.
“As workloads proceed to drive greater rack densities and cooling calls for, clients want liquid cooling options that adapt to their distinctive deployment methods, whether or not retrofitting an current atmosphere or scaling a brand new construct,” mentioned Sam Bainborough, vice chairman, EMEA thermal enterprise at Vertiv. “The Vertiv CoolChip CDU household provides versatile, scalable options that simplify deployment and help long-term development. By lowering integration complexity and adapting to a spread of knowledge centre environments, these CDUs assist organisations scale liquid cooling extra effectively.”
The brand new fashions are designed to go well with retrofit or greenfield knowledge centre environments, with fashions together with in-rack and row-based configurations, and liquid-to-air and liquid-to-liquid applied sciences. The modern methods supply a versatile, scalable strategy to deal with rising capability calls for whereas accelerating liquid cooling adoption.
The Vertiv CoolChip CDU household is a part of Vertiv’s complete liquid cooling providing and the broader Vertiv™ 360AI portfolio of energy, cooling and companies that remedy the complicated challenges of AI deployment. Backed by Vertiv™ Liquid Cooling Companies, a worldwide end-to-end providing that helps design, set up, commissioning, fluid administration, and upkeep, the liquid cooling portfolio suits in all kinds of situations starting from retrofitting current services to scaling high-density AI and HPC clusters in new builds.
Vertiv™ CoolChip CDU 70 is an in-row, liquid-to-air coolant distribution unit that permits a quick, cost-effective entry into liquid cooling for knowledge centres retrofitting current environments or deploying new infrastructure. Designed to utilise current thermal infrastructure, this liquid-to-air CDU is right for services seeking to deploy liquid cooling capability with out requiring main infrastructure adjustments. The system delivers as much as 70 kW of cooling capability and is designed for agility and scalability, serving to to cut back secondary fluid community complexity and infrastructure footprint. Its built-in controller helps real-time monitoring, group management and unit-to-unit communication, for coordinated thermal efficiency, simplified administration, and environment friendly scaling throughout a number of racks.
Vertiv™ CoolChip CDU 100 brings highly effective liquid-to-liquid in-rack cooling efficiency, giving knowledge centres a safe and space-efficient answer for high-density workloads. Ultimate for operators to introduce or broaden liquid cooling deployments one rack at a time, supporting incremental development or AI pilot packages with out the necessity for large-scale infrastructure adjustments. With 100 kW of cooling capability in a 4U type issue and a large-surface warmth exchanger engineered for low strategy temperatures, Vertiv CoolChip CDU 100 allows optimum warmth switch. An built-in controller offers monitoring and management capabilities to streamline operations and improve visibility. Constructed-in filtration and exact temperature management inside ±1°C assist keep fluid high quality and thermal stability, whereas the bodily separation of facility and IT loops helps safe, environment friendly system administration in mission-critical environments.
Vertiv™ CoolChip CDU 600 is an in-row, liquid-to-liquid mannequin delivering sturdy, scalable liquid cooling capability for high-density AI and HPC deployments. The 600 kW system is designed to satisfy the calls for of hyperscale and colocation environments, supporting in-row configurations and integrating simply into raised flooring or retrofit installations. Its design, together with high or backside piping connections and accessible inner manifolds, streamlines infrastructure planning and speeds implementation. With redundant pumps, superior monitoring for temperature and fluid high quality, and a versatile strategy to deployment, Vertiv CoolChip CDU 600 provides reliability, visibility, and efficiency for patrons scaling liquid cooling throughout broader IT environments.
