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Data Center News > Blog > Global Market > Samsung’s memory ramp-up may ease AI and cloud upgrade concerns
Global Market

Samsung’s memory ramp-up may ease AI and cloud upgrade concerns

Last updated: November 2, 2025 11:12 pm
Published November 2, 2025
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The corporate confirmed that its latest-generation HBM3E chips at the moment are being shipped to “all associated prospects,” a potential signal that offer to main AI chipmakers like Nvidia could also be stabilizing.

With mass manufacturing of HBM4 anticipated subsequent yr, Samsung may finally assist relieve strain on the broader enterprise infrastructure ecosystem, from cloud suppliers constructing new AI clusters to knowledge middle operators searching for to develop switching and storage capability.

Samsung’s Foundry division additionally plans to start working its new 2nm fab in Taylor, Texas, in 2026 and provide HBM4 base-dies, a transfer that might additional stabilize element availability for US cloud and networking infrastructure suppliers.

Easing the reminiscence chokehold

Easing DRAM and NAND lead occasions will unlock delayed infrastructure tasks, significantly amongst hyperscalers, in response to Manish Rawat, semiconductor analyst at TechInsights.

“As element availability improves from months to weeks, deferred server and storage upgrades can transition to lively scheduling,” Rawat mentioned. “Hyperscalers are anticipated to steer these restarts, adopted by giant enterprises as soon as pricing and supply stabilize. Improved entry to high-density reminiscence may also drive sooner refresh cycles and higher-performance rack designs, favoring denser server configurations. Procurement fashions might shift from long-term, buffer-heavy methods to extra agile, just-in-time or spot-buy approaches.”

Samsung’s expanded function as a “significant quantity provider” of HBM3E 12-high DRAM may also be essential for hyperscalers planning their 2026 AI infrastructure rollouts, in response to Danish Faruqui, CEO of Fab Economics.

“With out Samsung’s contribution, most hyperscaler ASIC packages, together with Google’s TPU v7, AWS’s Trainium 3, and Microsoft’s in-house accelerators, have been going through one- to two-quarter delays as a result of restricted HBM3E 12-high provide from SK Hynix,” Faruqui mentioned. “These merchandise kind the spine of next-generation AI knowledge facilities, and quantity ramp-up relies upon instantly on Samsung’s capability to ship.”

See also  Legrand Expands Data Center Reach with Strategic ZPE Systems Acquisition

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TAGGED: cloud, concerns, ease, memory, rampup, Samsungs, upgrade
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