Monday, 15 Dec 2025
Subscribe
logo
  • Global
  • AI
  • Cloud Computing
  • Edge Computing
  • Security
  • Investment
  • Sustainability
  • More
    • Colocation
    • Quantum Computing
    • Regulation & Policy
    • Infrastructure
    • Power & Cooling
    • Design
    • Innovations
    • Blog
Font ResizerAa
Data Center NewsData Center News
Search
  • Global
  • AI
  • Cloud Computing
  • Edge Computing
  • Security
  • Investment
  • Sustainability
  • More
    • Colocation
    • Quantum Computing
    • Regulation & Policy
    • Infrastructure
    • Power & Cooling
    • Design
    • Innovations
    • Blog
Have an existing account? Sign In
Follow US
© 2022 Foxiz News Network. Ruby Design Company. All Rights Reserved.
Data Center News > Blog > Innovations > New materials to manufacture advanced computer chips
Innovations

New materials to manufacture advanced computer chips

Last updated: December 10, 2024 7:57 pm
Published December 10, 2024
Share
computer chips
SHARE

Engineers want new supplies to make pc chips—and the units they energy—even smaller and extra environment friendly.

College members from the College of Dallas, collaborators, and business companions have teamed as much as design and take a look at indium-based supplies to fabricate the subsequent era of pc chips.

The researchers have obtained a $1.9m, three-year grant via the Nationwide Science Basis’s Future of Semiconductors (FuSe2) programme to help their work.

The UTD funding is a part of $42.4m in FuSe2 grants introduced in September to help the targets of the federal CHIPS (Creating Useful Incentives to Produce Semiconductors) and Science Act of 2022.

This goals to make pc chips extra energy-efficient and facilitate the home manufacturing of built-in circuits.

Bettering the efficiency of pc chips

By introducing indium-based supplies, the researchers intention to facilitate patterning within the excessive ultraviolet (EUV) vary. Patterning, or lithography, is a key step within the semiconductor fabrication course of through which patterns are created on the floor of a wafer to function pathways for transistors and different parts.

Transferring from deep UV to EUV vary makes it attainable to supply smaller, extra exact options on pc chips for higher efficiency and vitality effectivity.

In the course of the conventional patterning course of within the manufacturing of pc chips, silicon wafers are coated with a detachable layer of fabric known as a photoresist earlier than being uncovered to UV photons.

The following era of lithography makes use of very high-energy photons — 92 electronvolts — within the EUV area. As a result of excessive vitality of those photons, typical photoresist supplies is not going to work.

See also  Prototype LED as thin as wallpaper can glow like the sun

The researchers’ new supplies additionally might allow the manufacturing of 3D circuits, that are designed by stacking layers of chips like high-rises in a crowded metropolis.

New supplies are wanted to construct added layers on a 3D chip with out disturbing the present circuits.

Higher semiconducting properties with out overheating

“In case you are making a layer of units on prime of one other layer of units, you can’t warmth it to a excessive temperature. In any other case, you’ll destroy the present layers,” defined Dr Julia Hsu, professor of supplies science and engineering and chief of the examine.

Utilizing indium-containing supplies for the EUV photoresist and the transistors ought to result in extra effectivity in pc chips by eliminating a step in built-in circuit manufacturing that includes solvents.

The researchers are testing a method known as photonic curing to transform EUV-patterned constructions to nanoscale units.

Photonic curing makes use of pulses of sunshine at excessive depth however low vitality to finish the chemical reactions that enable the indium oxide to realize higher semiconducting properties with out overheating the underlying units.

Incorporating machine studying into the method

Hsu’s preliminary work on indium-containing supplies as an EUV photoresist has been supported by a Semiconductor Analysis Company (SRC) grant to research new supplies for pc chips.

Hsu additionally plans to include machine studying — a technique she discovered with help from a 2023 Simons Basis Pivot Fellowship — into the challenge’s design and testing methodologies.

“The FuSe2 challenge will allow us to take our preliminary outcomes from the SRC challenge to a a lot larger stage and greater influence,” Hsu mentioned.

See also  Applied Materials reveals chip wiring innovations for energy-efficient computing

“We’ll deliver computation and artificial chemistry to broaden past at the moment commercially out there supplies.”

Key collaborations within the challenge

Hsu’s co-principal investigators embrace Dr Cormac Toher, an assistant professor of supplies science and engineering and computational supplies scientist, and Dr Kevin Brenner, an assistant professor of supplies science and engineering.

Toher will design the indium-containing molecules, and Brenner will fabricate and take a look at the units.

The challenge additionally contains semiconductor business workforce coaching for neighborhood faculty college students via UTD’s North Texas Semiconductor Institute and a category that Hsu will train as an immersive expertise within the semiconductor business.

Source link

TAGGED: advanced, Chips, Computer, Manufacture, materials
Share This Article
Twitter Email Copy Link Print
Previous Article Smardex Raises $4.5M in Public Seed Round Smardex Raises $4.5M in Public Seed Round
Next Article Google Invests in Venture to Build Energy Parks for Data Centers Google Invests in Venture to Build Energy Parks for Data Centers
Leave a comment

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Your Trusted Source for Accurate and Timely Updates!

Our commitment to accuracy, impartiality, and delivering breaking news as it happens has earned us the trust of a vast audience. Stay ahead with real-time updates on the latest events, trends.
FacebookLike
TwitterFollow
InstagramFollow
YoutubeSubscribe
LinkedInFollow
MediumFollow
- Advertisement -
Ad image

Popular Posts

Computational marathon matches the efficiency of existing platform with the power of new supercomputer

After a ramp-up section of two.5 hours (with the machine nonetheless shared with different customers),…

September 16, 2024

Total Synergy Secures Strategic Investment from M33 Growth & PSG 

Total Synergy, a Sydney, Australia-based supplier of venture administration software program for structure and engineering…

November 15, 2024

Energy-efficient memory technology for sustainable computing

Researchers have found that SOT-MRAM reminiscence expertise may substitute cache reminiscence in pc structure sooner…

February 7, 2025

Car dealerships hit with massive computer system outage

CDK International, the corporate that gives administration software program for almost 15,000 automotive dealerships in…

June 20, 2024

Vapor IO, Supermicro team up to unveil Zero Gap AI powered by NVIDIA

Vapor IO and Supermicro unveil Zero Gap AI, a partnership with the NVIDIA MGX platform…

March 6, 2024

You Might Also Like

nVent electric unveils advanced liquid cooling solutions for data centres
Infrastructure

nVent electric unveils advanced liquid cooling solutions for data centres

By saad
semiconductor manufacturing
Innovations

EU injects €623m to boost German semiconductor manufacturing

By saad
Supermicro unveil advanced liquid-cooled NVIDIA HGX B300 systems
Power & Cooling

Supermicro unveil advanced liquid-cooled NVIDIA HGX B300 systems

By saad
NanoIC pilot line: Accelerating beyond-2nm chip innovation
Innovations

NanoIC pilot line: Accelerating beyond-2nm chip innovation

By saad
Data Center News
Facebook Twitter Youtube Instagram Linkedin

About US

Data Center News: Stay informed on the pulse of data centers. Latest updates, tech trends, and industry insights—all in one place. Elevate your data infrastructure knowledge.

Top Categories
  • Global Market
  • Infrastructure
  • Innovations
  • Investments
Usefull Links
  • Home
  • Contact
  • Privacy Policy
  • Terms & Conditions

© 2024 – datacenternews.tech – All rights reserved

Welcome Back!

Sign in to your account

Lost your password?
We use cookies to ensure that we give you the best experience on our website. If you continue to use this site we will assume that you are happy with it.
You can revoke your consent any time using the Revoke consent button.