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Data Center News > Blog > Innovations > Laser breakthrough brings 2D materials closer to chip factories
Innovations

Laser breakthrough brings 2D materials closer to chip factories

Last updated: January 8, 2026 7:04 am
Published January 8, 2026
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Laser breakthrough brings 2D materials closer to chip factories
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A European analysis and business consortium has unveiled a laser-based manufacturing course of that might considerably speed up the adoption of 2D supplies in mainstream semiconductor manufacturing.

Developed underneath the Horizon Europe–funded L2D2 project, the approach allows graphene and associated atomically skinny supplies to be transferred immediately onto CMOS-compatible and silicon photonics wafers, overcoming a long-standing barrier to industrial-scale integration.

The undertaking brings collectively companions from academia and business, together with the Nationwide Technical College of Athens, Graphenea Semiconductor, NVIDIA Mellanox, and Bar-Ilan College.

From lab curiosity to industrial actuality

Whereas 2D supplies similar to graphene have lengthy promised dramatic efficiency positive factors in electronics and photonics, integrating them into current chipmaking workflows has confirmed notoriously tough.

Typical switch strategies typically depend on polymers or solvents, which may contaminate surfaces, introduce defects, and restrict scalability. The L2D2 consortium claims its new strategy eliminates these points completely.

On the coronary heart of the advance is Laser Digital Switch, or LDT, a single-step, solvent-free course of that makes use of exactly managed laser pulses to maneuver and sample 2D supplies precisely the place they’re wanted.

The tactic works on the wafer scale and is suitable with commonplace semiconductor manufacturing traces, a important requirement for industrial uptake.

Precision at wafer scale

The LDT course of permits engineers to switch microscopic ‘pixels’ of graphene and different 2D supplies, with characteristic sizes starting from under 10 micrometres to a number of hundred micrometres.

Crucially, this may be carried out throughout full 4-inch and 8-inch wafers, aligning with the size utilized in silicon photonics and CMOS fabrication right this moment.

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As a result of the method avoids polymers and liquid chemical compounds, the transferred layers stay clear and structurally intact.

In keeping with the consortium, this ends in reproducible, defect-free integration that may be automated, opening the door to high-volume manufacturing.

Professor Ioanna Zergioti, NTUA – Mission Coordinator, emphasised the importance of the breakthrough:  “LDT represents a decisive step towards bridging the hole between 2D supplies analysis and semiconductor-grade manufacturing.

“Our outcomes show that wafer-scale integration is now inside attain.”

Powering the following era of photonics

The implications lengthen far past supplies science. By making 2D supplies simpler to combine with silicon platforms, the know-how may allow a brand new class of nano-optoelectronic units.

Potential functions embrace quicker and extra energy-efficient optical modulators, extremely delicate photodetectors, compact built-in transceivers, and superior sensing techniques.

If efficiently commercialised, Laser Digital Switch may mark a turning level, shifting 2D supplies from experimental promise to sensible deployment in next-generation chips.

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TAGGED: Breakthrough, brings, Chip, closer, Factories, laser, materials
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