Tesla, SpaceX, and xAI say that Terafab would be the largest chip manufacturing facility ever, outputting 1TW a yr of compute energy and “combining logic, reminiscence and superior packaging under one roof.”
Intel’s means to “design, fabricate, and package deal ultra-high-performance chips at scale” will assist speed up these 1TW/yr ambitions, the corporate stated in its X publish. The Santa Clara-headquartered tech large hosted the world’s richest man over the Easter weekend, and CEO Lip-Bu Tan lauded Musk’s “confirmed monitor file of reimagining total industries.”
“That is precisely what is required in semiconductor manufacturing at this time,” Tan wrote in a separate X post. “Terafab represents a step change in how silicon logic, reminiscence and packaging will get constructed sooner or later.”
The superior chip middle is concentrating on 2-nanometer course of (2nm) know-how, essentially the most superior chip era know-how in industrial manufacturing. It’s designed for an preliminary output of 100,000 uncooked silicon wafers a month, with a aim to scale to 1 million wafer begins per thirty days at full capability.
Musk’s ambitions are to in the end produce between 100 billion and 200 billion customized AI and reminiscence chips a yr. Through the unveiling occasion, the near-trillionaire stated that Terafab will create an “extremely quick recursive loop” to enhance chip improvement.
The partnership comes as Intel pushes additional into superior chip packaging, the place a number of chiplets, or smaller parts, are mixed onto a single customized chip. Tan has known as this a “very massive differentiator” for Intel.
