Innovations

AI toys that talk with children raise safety concerns

Cambridge researchers say clearer regulation and security requirements are wanted as generative synthetic intelligence (GenAI) toys enter early childhood environments. AI toys designed to converse with younger kids could require

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Armada and Nscale outline global hub-and-spoke model for Sovereign AI infrastructure

Edge infrastructure options supplier Armada and Nscale have inked a Letter of Intent (LOI) to create

Trane Technologies to acquire LiquidStack to expand data centre cooling capabilities

Trane Applied sciences has entered a definitive settlement to accumulate LiquidStack, a supplier of liquid

Amazon plans huge AWS investment to meet AI cloud demand

Cloud capability is turning into one of many predominant constraints on enterprise AI adoption, and

OVHcloud introduces bare metal 2026 server line

OVHcloud has introduced the discharge of its new Naked Steel 2026 vary, representing an replace

Lasted Innovations

Fiber computer allows apparel to run apps and ‘understand’ the wearer

US Military Main Hefner coaching in Norway sporting Fiber pc base layer. Credit score: US Military Chilly Areas Analysis &

Reinventing the Finnish ecosystem to support the Chips Act targets

Kvanttinova’s CEO, Jussi Tuovinen, explains how Finland is remodeling its expertise ecosystem to develop into a worldwide chief in chip

Washable touchless technology could transform electronic textiles

The textile could be operated by the person by using a hoop or glove. Credit score: Free College of Bozen-Bolzano

Addressing the risks of artificial intelligence to human rights

Mario Hernández Ramos, Chair of the Committee on Synthetic Intelligence of the Council of Europe, identifies the principle dangers of

Wearable bionic device mimics birds’ extraordinary sight

{Photograph} of the array on PDMS and PET substrates with long-term plasticity. Credit score: Nature Communications (2024). DOI: 10.1038/s41467-024-52563-4 Scientists

New conductive-bridge interlayer contacts could boost performance of 2D optoelectronics

Idea of the CBIC. a, Comparability of the proposed and conventional contact architectures: (i) steel–semiconductor (MS) contact; (ii) MIS contact

Novel system optimizes the electrical, thermal and mechanical behavior of 3D printed materials

Optimization of 3D printed supplies. Credit score: UC3M Universidad Carlos III de Madrid (UC3M), in collaboration with the College of

EU invests €227M in Austrian wafer manufacturing plant

The European Fee has authorized a €227m Austrian initiative to assist ams Osram in establishing a state-of-the-art wafer manufacturing facility